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Table of Contents
A solder ball also known as a solder bump is a ball of solder that provides the contact between the chip package and the printed circuit board. It can also be used in stacked packages in multichip modules. The solder balls can be placed either with manually or by automated equipment, and are held in place with a tacky flux. In BGA package, solder ball is small sphere of solder that provides the contact between the BGA package and the printed circuit board. Solder ball could be damaged after fabrication of the BGA package; it could produce bad connections due to bad assembly. PCB which fails due to bad BGA connections can be repaired either by reflowing, or by removing the chip and cleaning it of solder, replacing old solder ball.
Solder Balls Market is showing growth primarily because of growth of Automotive industry and Electronic industry. Automotive industry is growing at faster rate due to high demand for Automobile globally. While Electronic market in Asia Pacific region has shown tremendous growth due to large population and increase in disposable income. China, Japan, South Korea are the largest manufactures globally helping Solder Balls Market to grow with CAGR of 6.8%.
Technological advanced Solder Balls production and use has emerged as driving factor in growth of Solder Balls Market. Use of Solder Balls in circuit and packaging increase contact reliability significantly this increases life time of device. High performance solder balls are increasing device performance significantly by providing high quality contact in circuit. Availability low toxic material for manufacturing created environmental issue for Solder Balls industry as manufactures are facing lot of problems from government. Leading manufactures are overcoming these environment issues with using lead free material and advanced technique to produce Eco friendly Solder Balls.
Global Solder Balls Market : Product Type Analysis
Global Solder Balls Market : End User/ Applications Analysis
Global Solder Balls Market : Competitive Analysis
Report includes accurate analysis of key players with Market Value, Company profile, SWOT analysis. The Study consists of following key players
Solder Balls Market: Regional Analysis
Global Solder Balls Market Report Report delivers a comprehensive analysis of the following parameters:
Parameters | Details |
---|---|
Base Year |
2024 |
Historical Data |
2019-2024 |
Forecast Data |
2025-2031 |
Base Year Value (2024) |
USD 328.91 million |
Forecast Value (2031) |
USD 521.29 million |
CAGR (2025-2031) |
6.8 % |
Regional Scope |
North America, Europe, Asian Pacific, Latin America, Middle East and Africa, and ROW |
Solder Balls Market Report was valued at around USD 328.91 million in 2024 & is estimated to reach USD 521.29 million by 2031.
Solder Balls Market Report is likely to grow at Compound Annual Growth Rate (CAGR) of 6.8% between 2025-2031.
Asia Pacific region has shown tremendous growth due to large population and increase in disposable income.
Some of the top key players of the Solder Balls Market are Duksan Metal,Hitachi Metals Nanotech,Nippon Micrometal,Indium Corporation,Senju Metal
Solder Balls Market is showing growth primarily because of growth of Automotive industry and Electronic industry.
Yes, the report includes Geopolitical impact on the market.
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